| Ceramic | Ceramic dielectric, commonly multilayer ceramic construction. Class 1 types offer high stability; Class 2 types provide higher capacitance per volume. | About 1 pF to 100 µF, depending on dielectric class, package size, and voltage rating. | Approximately 6.3 V to 5 kV or higher for specialized parts. | Non-polarized | About ±0.05% to ±20%; ±5% and ±10% are common. | Very low ESR and excellent high-frequency performance. Class 2 capacitance can change with DC bias, temperature, and aging. | Class 1: highly stable. Class 2: commonly rated around −55°C to +125°C, with capacitance variation depending on dielectric code. | Small size, low loss, low ESR, strong high-frequency filtering, and long service life. | Large-value parts may lose capacitance under DC bias; brittle bodies can crack under mechanical stress; some devices can be acoustically active. | Decoupling, bypassing, RF circuits, resonant networks, timing, signal filtering, and voltage stabilization. |
| Electrolytic | Anodized aluminum or similar valve-metal electrode with a liquid, polymer, or hybrid electrolyte. | About 0.1 µF to 100,000 µF; very large values are widely available. | Approximately 6.3 V to 700 V, with higher-voltage specialty designs available. | Usually polarized; bipolar versions exist for selected AC applications. | Typically ±20%; tighter tolerances are available but less common. | Higher ESR and leakage than ceramic or film types. Performance generally declines as frequency increases. | Commonly −40°C to +105°C or +125°C. Useful life depends strongly on temperature, ripple current, and operating conditions. | Very high capacitance, good energy storage, cost-effective bulk filtering, and strong ripple-current options. | Polarity must be observed; finite service life; comparatively high leakage, ESR, size, and tolerance. | Power-supply smoothing, DC-link filtering, bulk decoupling, audio equipment, and energy buffering. |
| Film | Plastic film dielectric such as polypropylene or polyester, using wound or stacked metalized-film construction. | Approximately 10 pF to 100 µF; high-capacitance power-film parts may be physically large. | About 16 V to 30 kV, depending on construction and application. | Non-polarized | Commonly ±1%, ±2%, ±5%, or ±10%. | Low ESR and low dielectric loss, with stable behavior over frequency. Suitable for high pulse currents in appropriate designs. | Often rated around −40°C to +85°C, +105°C, or +125°C; generally exhibits low aging and good stability. | Excellent stability, low loss, high pulse capability, self-healing in many metalized designs, and no polarity requirement. | Larger physical size, lower capacitance density, and often higher cost than ceramic or electrolytic alternatives. | AC filtering, snubbers, timing, audio signal paths, motor-run circuits, resonant converters, and power-factor correction. |
| Tantalum | Porous tantalum anode with a tantalum-oxide dielectric and solid manganese-dioxide or conductive-polymer cathode system. | Approximately 0.1 µF to 1,000 µF, with many practical values in the 1 µF to 470 µF range. | Typically 2.5 V to 100 V; higher-voltage parts are less common. | Polarized; reverse voltage must be avoided. | Commonly ±10% or ±20%; tighter tolerances are available. | Lower ESR than many conventional electrolytics, particularly for polymer types, but ESR and ripple capability vary significantly by construction. | Often rated around −55°C to +125°C. Capacitance and reliability depend on temperature, applied voltage, ripple, and surge conditions. | High capacitance density, compact size, stable capacitance, and useful low-ESR options. | Sensitive to reverse voltage, surge current, and overvoltage; failure can be abrupt if derating and protection are inadequate. | Portable electronics, compact power rails, processor decoupling, telecommunications equipment, and space-constrained circuits. |